Reliability performance of tin–bismuth–silver (Sn57.6Bi0.4Ag) solder joints with different content of carbon nano-tubes (CNTs) or nickel (Ni)-modified CNTs
Crossref DOI link: https://doi.org/10.1007/s10854-018-8872-z
Published Online: 2018-03-14
Published Print: 2018-05
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Sun, Huayu
Chan, Y. C.
Wu, Fengshun
Text and Data Mining valid from 2018-03-14
Version of Record valid from 2018-03-14
Article History
Received: 26 October 2017
Accepted: 8 March 2018
First Online: 14 March 2018