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Interfacial evolution in Sn–58Bi solder joints during liquid electromigration

Published Online: 2018-03-15

Published Print: 2018-06

Authors

Wang, Fengjiang https://orcid.org/0000-0002-0613-8129
Liu, Luting

Wu, Mingfang

Li, Dongyang
Funding

Funding for this research was provided by:

Postgraduate Research & Practice Innovation Program of Jiangsu Province (KYCX17_1835)
License Information

Text and Data Mining valid from 2018-03-15
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Article History

Received: 4 December 2017

Accepted: 12 March 2018

First Online: 15 March 2018

Compliance with ethical standards

:

: The authors declare no conflict of interest.

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