Solid-state bonding of silicon chips to copper substrates with graded circular micro-trenches
Crossref DOI link: https://doi.org/10.1007/s10854-018-9047-7
Published Online: 2018-04-05
Published Print: 2018-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Chen, Yi-Ling
Wu, Jiaqi
Lee, Chin C.
Text and Data Mining valid from 2018-04-05
Version of Record valid from 2018-04-05
Article History
Received: 13 February 2018
Accepted: 3 April 2018
First Online: 5 April 2018