Crossmark

Interfacial microstructure evolution and shear strength of Sn0.7Cu–xNi/Cu solder joints

Crossref DOI link: https://doi.org/10.1007/s10854-018-9219-5

Published Online: 2018-05-04

Published Print: 2018-07

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Lai, Yanqing

Hu, Xiaowu

Li, Yulong

Jiang, Xiongxin
Funding

Funding for this research was provided by:

Nature Science Foundation of China (51465039)

Nature Science Foundation of China (51765040)

Nature Science Foundation of China (51665038)

Nature Science Foundation of Jiangxi Province (20161BAB206122)

Key project of the natural science foundation of Jiangxi province (20171ACB21011)
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Article History

Received: 29 March 2018

Accepted: 30 April 2018

First Online: 4 May 2018