Microstructure and hardness of SAC305-xNi solder on Cu and graphene-coated Cu substrates
Crossref DOI link: https://doi.org/10.1007/s10854-018-9440-2
Published Online: 2018-06-09
Published Print: 2018-08
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Liu, Yang http://orcid.org/0000-0002-4311-2198
Li, Shengli
Zhang, Hao
Cai, Hongming
Sun, Fenglian
Zhang, Guoqi
Text and Data Mining valid from 2018-06-09
Article History
Received: 28 March 2018
Accepted: 8 June 2018
First Online: 9 June 2018