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Solid porous Ag–Ag interface bonding and its application in the die-attached modules

Published Online: 2018-06-16

Published Print: 2018-08

Authors

Chen, Chuantong

Suganuma, Katsuaki
Funding

Funding for this research was provided by:

Advanced Low Carbon Technology Research and Development Program (JPMJAL1610)
License Information

Text and Data Mining valid from 2018-06-16

Version of Record valid from 2018-06-16
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Article History

Received: 6 February 2018

Accepted: 11 June 2018

First Online: 16 June 2018

Document is current