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Light enhanced direct Cu bonding for advanced electronic assembly

Crossref DOI link: https://doi.org/10.1007/s10854-018-9547-5

Published Online: 2018-06-27

Published Print: 2018-08

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Liang, Sin-Yong

Song, Jenn-Ming https://orcid.org/0000-0002-9020-2911
Huang, Shang-Kun

Chiu, Ying-Ta

Tarng, David

Hung, Chih-Pin
Funding

Funding for this research was provided by:

Ministry of Science and Technology, Taiwan (NSC 101-2628-E-005-001-MY2 and MOST 106-2221 -E-005-028-MY3)

Ministry of Education (Featured research center program (Higher education sprout project))
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Article History

Received: 6 April 2018

Accepted: 21 June 2018

First Online: 27 June 2018