Thermal aging effects on microstructure, elastic property and damping characteristic of a eutectic Sn–3.5Ag solder
Crossref DOI link: https://doi.org/10.1007/s10854-018-9586-y
Published Online: 2018-07-04
Published Print: 2018-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Gain, Asit Kumar
Zhang, Liangchi
Funding for this research was provided by:
University of New South Wales (RG124326)
Text and Data Mining valid from 2018-07-04
Article History
Received: 21 January 2018
Accepted: 2 July 2018
First Online: 4 July 2018