The interfacial bilayer Cu6Sn5 formed in a Sn–Ag–Cu flip-chip solder joint incorporating Au/Pd metallization during solid-state aging
Crossref DOI link: https://doi.org/10.1007/s10854-018-9665-0
Published Online: 2018-07-14
Published Print: 2018-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Liang, Chien-Lung http://orcid.org/0000-0003-3062-8811
Lin, Kwang-Lung
Cheng, Po-Jen
Funding for this research was provided by:
Ministry of Science and Technology, Taiwan (MOST 104-2221-E-006-028-MY3)
Text and Data Mining valid from 2018-07-14
Article History
Received: 14 May 2018
Accepted: 12 July 2018
First Online: 14 July 2018