Effect of solder layer thickness on thermo-mechanical reliability of a power electronic system
Crossref DOI link: https://doi.org/10.1007/s10854-018-9667-y
Published Online: 2018-07-16
Published Print: 2018-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Surendar, A.
Samavatian, Vahid
Maseleno, Andino
Ibatova, Aygul Z.
Samavatian, Majid
Text and Data Mining valid from 2018-07-16
Article History
Received: 12 September 2017
Accepted: 12 July 2018
First Online: 16 July 2018