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Effect of Cu6Sn5 nanoparticle on thermal behavior, mechanical properties and interfacial reaction of Sn3.0Ag0.5Cu solder alloys

Crossref DOI link: https://doi.org/10.1007/s10854-018-9684-x

Published Online: 2018-07-19

Published Print: 2018-09

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Hu, Xiaowu

Qiu, Yu

Jiang, Xiongxin

Li, Yulong
Funding

Funding for this research was provided by:

The Nature Science Foundation of China (51465039)

The Nature Science Foundation of China (51665038)

The Nature Science Foundation of China (51765040)

Nature Science Foundation of Jiangxi Province (20161BAB206122)

Key project of the natural science foundation of Jiangxi province (20171ACB21011)
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Article History

Received: 21 May 2018

Accepted: 16 July 2018

First Online: 19 July 2018