Microstructure and mechanical properties of indium–bismuth alloys for low melting-temperature solder
Crossref DOI link: https://doi.org/10.1007/s10854-018-9738-0
Published Online: 2018-07-27
Published Print: 2018-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Jin, Sanghun http://orcid.org/0000-0002-1349-9344
Kim, Min-Su
Kanayama, Shutetsu
Nishikawa, Hiroshi
Text and Data Mining valid from 2018-07-27
Article History
Received: 6 February 2018
Accepted: 24 July 2018
First Online: 27 July 2018