Highly thermostable joint of Cu/Ni plating/composite Sn–0.7Cu solder with added Cu balls for die attachment in power modules
Crossref DOI link: https://doi.org/10.1007/s10854-018-9943-x
Published Online: 2018-08-27
Published Print: 2018-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kadoguchi, Takuya
Take, Naoya
Yamanaka, Kimihiro
Nagao, Shijo
Suganuma, Katsuaki
Text and Data Mining valid from 2018-08-27
Article History
Received: 9 June 2018
Accepted: 23 August 2018
First Online: 27 August 2018