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A low temperature die attach technique for high temperature applications based on indium infiltrating micro-porous Ag sheet

Published Online: 2018-08-25

Published Print: 2018-11

Authors

Xie, Xingchi

Hang, Chunjin

Wang, Jianqiang

Su, Yue

Ma, Jie

Guo, Qiang

Chen, Hongtao

Li, Mingyu
Funding

Funding for this research was provided by:

Science and Technology Project of Shenzhen (JCYJ20160320095308401)
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Text and Data Mining valid from 2018-08-25
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Article History

Received: 7 July 2018

Accepted: 23 August 2018

First Online: 25 August 2018

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