Effect of silver powders on a low curing temperature silver conductive adhesive
Crossref DOI link: https://doi.org/10.1007/s10854-018-9971-6
Published Online: 2018-09-04
Published Print: 2018-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wang, Xiao-Qing http://orcid.org/0000-0001-8702-4598
Gan, Wei-Ping
Zhou, Jian
Xiang, Feng
Long, Meng
Peng, Deng-Er
Text and Data Mining valid from 2018-09-04
Article History
Received: 2 June 2018
Accepted: 29 August 2018
First Online: 4 September 2018