Unique interfacial reaction and so-induced change in mechanical performance of Sn–3.0Ag–0.5Cu/Cu solder joints formed during undercooled and eutectic liquid soldering processes
Crossref DOI link: https://doi.org/10.1007/s10854-019-00771-w
Published Online: 2019-01-25
Published Print: 2019-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Zhou, M. B.
Zhao, X. F.
Yue, W.
Zhang, X. P. http://orcid.org/0000-0002-5181-4026
Funding for this research was provided by:
National Natural Science Foundation of China (51405162, 51565024, 51775195)
Text and Data Mining valid from 2019-01-25
Article History
Received: 31 December 2018
Accepted: 17 January 2019
First Online: 25 January 2019