Glass transition temperature of nanoparticle-enhanced and environmentally stressed conductive adhesive materials for electronics assembly
Crossref DOI link: https://doi.org/10.1007/s10854-019-00784-5
Published Online: 2019-02-12
Published Print: 2019-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Mach, Pavel
Geczy, Attila
Polanský, Radek
Bušek, David
Text and Data Mining valid from 2019-02-12
Article History
Received: 17 October 2018
Accepted: 3 January 2019
First Online: 12 February 2019