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Effects of twin boundaries on the void formation in Cu-filled through silicon vias under thermal process

Crossref DOI link: https://doi.org/10.1007/s10854-019-00882-4

Published Online: 2019-02-19

Published Print: 2019-03

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Zhao, Xuewei

Ma, Limin

Wang, Yishu

Guo, Fu
Funding

Funding for this research was provided by:

Beijing Nova Program (Z161100004916155)

Natural Science Foundation of Beijing Municipality (2172006, 2172009)

Beijing Municipal Excellent Talents Foundation (CIT&TCD201804007)

General Project of Science and Technology of Beijing Municipal Education Commission (SQKM201610005024)
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Article History

Received: 17 August 2018

Accepted: 4 February 2019

First Online: 19 February 2019

Compliance with ethical standards

:

: There are no conflict of interest.