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Electromigration behavior of Cu/Sn3.0Ag0.5Cu/Cu ball grid array solder joints

Published Online: 2019-02-19

Published Print: 2019-03

Authors

Jiang, Yiming

Li, Hailong https://orcid.org/0000-0002-6194-3737
Chen, Gang

Mei, Yunhui

Wang, Meiyu
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (U1637203)
License Information

Text and Data Mining valid from 2019-02-19
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Article History

Received: 19 November 2018

Accepted: 11 February 2019

First Online: 19 February 2019

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