Electromigration reliability of Sn–3.0Ag–0.5Cu/Cu–Zn solder joints
Crossref DOI link: https://doi.org/10.1007/s10854-019-01080-y
Published Online: 2019-03-11
Published Print: 2019-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Park, Jae-Yong
Lee, Taeyoung
Seo, Wonil
Yoo, Sehoon
Kim, Young-Ho
Text and Data Mining valid from 2019-03-11
Article History
Received: 1 November 2018
Accepted: 6 March 2019
First Online: 11 March 2019