Effects of flux formulation temperature on printing and wetting properties of Sn–3.0Ag–0.5Cu solder
Crossref DOI link: https://doi.org/10.1007/s10854-019-01169-4
Published Online: 2019-04-03
Published Print: 2019-05
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kwon, Soonyong
Lee, Hoo-Jeong
Yoo, Sehoon http://orcid.org/0000-0001-7036-6188
Funding for this research was provided by:
Korea Institute of Industrial Technology
Text and Data Mining valid from 2019-04-03
Article History
Received: 19 December 2018
Accepted: 18 March 2019
First Online: 3 April 2019