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Shear strength between Sn–3.0Ag–0.5Cu solders and Cu substrate after two solid-state aging processes for fan-out package process applications

Crossref DOI link: https://doi.org/10.1007/s10854-019-01399-6

Published Online: 2019-05-08

Published Print: 2019-06

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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