Crossmark

Co-sputtering Co–Ti alloy as a single barrier/liner for Co interconnects and thermal stability enhancement using TiN metal capping

Crossref DOI link: https://doi.org/10.1007/s10854-019-01402-0

Published Online: 2019-05-03

Published Print: 2019-06

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Zhang, Dan

Xu, Jing

Mao, Shujuan

Zhao, Chao

Wang, Guilei

Luo, Xue

Li, Junfeng

Li, Yongliang

Wang, Wenwu

Chen, Dapeng

Ye, Tianchun

Luo, Jun
Funding

Funding for this research was provided by:

National Key Project of Science and Technology of China (2017ZX02315001)

Youth Innovation Promotion Association of the Chinese Academy of Sciences (No. 2015097)
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Article History

Received: 13 March 2019

Accepted: 23 April 2019

First Online: 3 May 2019