Solder interconnects reliability subjected to thermal-vibration coupling loading
Crossref DOI link: https://doi.org/10.1007/s10854-019-01501-y
Published Online: 2019-05-21
Published Print: 2019-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Jiao, Honghao
Liu, Yang http://orcid.org/0000-0002-8480-9637
Sun, Fenglian
Wu, Nan
Fang, Hongyuan
Funding for this research was provided by:
National Natural Science Foundation of China (51174069)
Text and Data Mining valid from 2019-05-21
Version of Record valid from 2019-05-21
Article History
Received: 15 February 2019
Accepted: 10 May 2019
First Online: 21 May 2019