Effects of substrate annealing on wettability and intermetallic compound formation in Sn–3.0Cu/Cu systems
Crossref DOI link: https://doi.org/10.1007/s10854-019-01566-9
Published Online: 2019-05-29
Published Print: 2019-07-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Mookam, Niwat
Kanlayasiri, Kannachai http://orcid.org/0000-0002-0588-7304
Text and Data Mining valid from 2019-05-29
Version of Record valid from 2019-05-29
Article History
Received: 31 January 2019
Accepted: 22 May 2019
First Online: 29 May 2019