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Thermal and mechanical property of FCLED package component interconnected with Sn–MWCNT composite solder

Published Online: 2019-06-06

Published Print: 2019-07

Authors

Lee, Choong-Jae

Jeong, Haksan

Jung, Kwang-Ho

Min, Kyung Deuk

Jung, Seung-Boo
Funding

Funding for this research was provided by:

National Research Foundation of Korea (2017R1D1A1B03035587)

Korea Institute for Advancement of Technology (P0002867)
License Information

Text and Data Mining valid from 2019-06-06

Version of Record valid from 2019-06-06
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Article History

Received: 30 March 2019

Accepted: 3 June 2019

First Online: 6 June 2019

Document is current