Effects of Ni layer thickness of thin-ENEPIG surface finishes on the interfacial reactions and shear strength of Sn-3.0Ag–0.5Cu solder joints during aging
Crossref DOI link: https://doi.org/10.1007/s10854-019-01653-x
Published Online: 2019-06-08
Published Print: 2019-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kim, Jungsoo
Back, Jong-Hoon
Jung, Seung-Boo
Yoon, Jeong-Won http://orcid.org/0000-0001-8708-542X
Funding for this research was provided by:
Ministry of Trade, Industry and Energy, Republic of Korea (10062737)
Text and Data Mining valid from 2019-06-08
Version of Record valid from 2019-06-08
Article History
Received: 8 April 2019
Accepted: 3 June 2019
First Online: 8 June 2019