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Leveraging prior strain rates effect during stress relaxation of Sn–1.7Ag–0.7Cu lead-free alloys with microalloying of Te and Co for microelectronics applications

Crossref DOI link: https://doi.org/10.1007/s10854-019-01758-3

Published Online: 2019-07-01

Published Print: 2019-07

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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