Void fraction of a Sn–Ag–Cu solder joint underneath a chip resistor and its effect on joint strength and thermomechanical reliability
Crossref DOI link: https://doi.org/10.1007/s10854-019-01935-4
Published Online: 2019-08-12
Published Print: 2019-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Seo, Wonil
Ko, Yong-Ho
Kim, Young-Ho
Yoo, Sehoon http://orcid.org/0000-0001-7036-6188
Funding for this research was provided by:
Korea Institute of Industrial Technology
Text and Data Mining valid from 2019-08-12
Version of Record valid from 2019-08-12
Article History
Received: 24 March 2019
Accepted: 25 July 2019
First Online: 12 August 2019