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Shear strength, fracture mechanism and plastic performance of Cu/Sn5Sb–xCuNiAg/Cu solder joints during thermal aging

Published Online: 2019-09-30

Published Print: 2019-10

Authors

Han, Bangyao

Sun, Fenglian

Li, Tianhui

Liu, Yang
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (51174069)
License Information

Text and Data Mining valid from 2019-09-30

Version of Record valid from 2019-09-30
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Article History

Received: 21 July 2019

Accepted: 11 September 2019

First Online: 30 September 2019

Document is current