Thermal sintering of printable copper for enhanced conductivity of FTO coated glass substrates
Crossref DOI link: https://doi.org/10.1007/s10854-019-02358-x
Published Online: 2019-10-19
Published Print: 2019-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Abbas, Bahaa
Mohammad, Youmna
Jewell, Eifion https://orcid.org/0000-0002-6894-2251
Searle, Justin
Funding for this research was provided by:
Engineering and Physical Sciences Research Council (EP/N509905/1, EP/N020863/1)
Text and Data Mining valid from 2019-10-19
Version of Record valid from 2019-10-19
Article History
Received: 8 September 2019
Accepted: 10 October 2019
First Online: 19 October 2019