Mechanical characteristics and fracture behavior of GaN/DBA die-attached during thermal aging: pressure-less hybrid Ag sinter joint and Pb–5Sn solder joint
Crossref DOI link: https://doi.org/10.1007/s10854-019-02563-8
Published Online: 2019-11-15
Published Print: 2020-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kim, Dongjin
Chen, Chuantong http://orcid.org/0000-0002-2365-4387
Nagao, Shijo
Suganuma, Katsuaki
Funding for this research was provided by:
Advanced Low Carbon Technology Research and Development Program (JPMJAL1610)
Text and Data Mining valid from 2019-11-15
Version of Record valid from 2019-11-15
Article History
Received: 12 September 2019
Accepted: 8 November 2019
First Online: 15 November 2019