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Epoxy/silane pre-synthesis improving thermal properties and adhesion strength of silica-filled non-conductive adhesive for fine-pitch thermocompression bonding

Crossref DOI link: https://doi.org/10.1007/s10854-019-02634-w

Published Online: 2019-11-30

Published Print: 2020-01

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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