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Micron-sized Ag flake particles direct die bonding on electroless Ni–P-finished DBC substrate: low-temperature pressure-free sintering, bonding mechanism and high-temperature aging reliability

Crossref DOI link: https://doi.org/10.1007/s10854-019-02636-8

Published Online: 2019-11-29

Published Print: 2020-01

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Chen, Chuantong https://orcid.org/0000-0002-2365-4387
Zhang, Zheng

Zhang, Bowen

Suganuma, Katsuaki
Funding

Funding for this research was provided by:

Advanced Low Carbon Technology Research and Development Program (JPMJAL1610)
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Text and Data Mining valid from 2019-11-29

Version of Record valid from 2019-11-29
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Article History

Received: 17 September 2019

Accepted: 22 November 2019

First Online: 29 November 2019

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