Effect of oxygen content on reliability of Au-20Sn solder joints for the chip-level package
Crossref DOI link: https://doi.org/10.1007/s10854-019-02655-5
Published Online: 2019-12-04
Published Print: 2020-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wang, Liujue
Xue, Songbai http://orcid.org/0000-0003-1546-9533
Liu, Han
Wang, Jianhao
Funding for this research was provided by:
National Natural Science Foundation of China (51675269)
Text and Data Mining valid from 2019-12-04
Version of Record valid from 2019-12-04
Article History
Received: 26 August 2019
Accepted: 27 November 2019
First Online: 4 December 2019