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Design and solderability characterization of novel Au–30Ga solder for high-temperature packaging

Published Online: 2020-01-02

Published Print: 2020-02

Authors

Liu, Han

Xue, Songbai https://orcid.org/0000-0003-1546-9533
Tao, Yu

Long, Weimin

Zhong, Sujuan
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (51675269)

State Key Laboratory of Advanced Brazing Filler Metals & Technology (SKLABFMT201704)
License Information

Text and Data Mining valid from 2020-01-02

Version of Record valid from 2020-01-02
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Article History

Received: 5 November 2019

Accepted: 19 December 2019

First Online: 2 January 2020

Document is current