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Fracture behavior and mechanical strength of sandwich structure solder joints with Cu–Ni(P) coating during thermal aging

Published Online: 2020-01-25

Published Print: 2020-03

Authors

Xu, Tao

Hu, Xiaowu https://orcid.org/0000-0003-2144-8851
Li, Jiayin

Li, Qinglin
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (51765040)

Natural Science Foundation of Jiangxi Province (20192ACB21021)

Outstanding Young talents funding of Jiangxi Province (20192BCB23002)
License Information

Text and Data Mining valid from 2020-01-25

Version of Record valid from 2020-01-25
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Article History

Received: 6 December 2019

Accepted: 17 January 2020

First Online: 25 January 2020

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