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Enhancing thermal conductivity of the insulating layer of high-frequency copper clad laminates via incorporating surface modified spherical hBN fillers

Crossref DOI link: https://doi.org/10.1007/s10854-020-02974-y

Published Online: 2020-02-03

Published Print: 2020-03

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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