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Effect of doping Ni nanoparticles on microstructure evolution and shear behavior of Sn–3.0Ag–0.5Cu(SAC305)/Cu–2.0Be solder joints during reflowing

Published Online: 2020-02-13

Published Print: 2020-03

Authors

Yin, Zuozhu https://orcid.org/0000-0002-9018-2367
Lin, Mei

Li, Qi

Wu, Ziyuan
Funding

Funding for this research was provided by:

Key Laboratory Foundation of Metal Material Microstructure Control of Jiangxi Province (EJ201903064)
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Text and Data Mining valid from 2020-02-13

Version of Record valid from 2020-02-13
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Article History

Received: 6 January 2020

Accepted: 4 February 2020

First Online: 13 February 2020

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