Preparation of Sn–58Bi solder powder by shearing liquids into complex particles
Crossref DOI link: https://doi.org/10.1007/s10854-020-03131-1
Published Online: 2020-02-24
Published Print: 2020-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Gong, Mengqi
Shen, Jun https://orcid.org/0000-0002-5769-1223
Nee, Ping
Hu, Dan
Funding for this research was provided by:
Fundamental Research Funds for the Central Universities of China (2018CDGFCL0003)
Text and Data Mining valid from 2020-02-24
Version of Record valid from 2020-02-24
Article History
Received: 8 December 2019
Accepted: 15 February 2020
First Online: 24 February 2020