Effect of bismuth–tin composition on bonding strength of zinc particle–mixed copper nanoparticle/bismuth–tin solder hybrid joint
Crossref DOI link: https://doi.org/10.1007/s10854-020-03211-2
Published Online: 2020-03-13
Published Print: 2020-05
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Satoh, Toshikazu
Usui, Masanori
Text and Data Mining valid from 2020-03-13
Version of Record valid from 2020-03-13
Article History
Received: 17 December 2019
Accepted: 5 March 2020
First Online: 13 March 2020