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Microstructural, compositional and hardness evolutions of 96.5Sn–3Ag–0.5Cu/TiC composite solder under thermo-migration stressing

Published Online: 2020-05-02

Published Print: 2020-06

Authors

Chen, Guang

Cui, Xinzhan

Wu, Yaofeng

Li, Wei https://orcid.org/0000-0002-0286-2646
Wu, Fengshun
Funding

Funding for this research was provided by:

National Nature Science Foundation of China (61804135)

Natural Science Foundation of Zhejiang Province of China (LQ17E050004)

Postdoctoral Research Foundation of China (2019M652567)

Postdoctoral scholarship of Zhejiang Province (221623)
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Text and Data Mining valid from 2020-05-02

Version of Record valid from 2020-05-02
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Article History

Received: 2 February 2020

Accepted: 25 April 2020

First Online: 2 May 2020

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