Effect of Ag-decorated MWCNT on the mechanical and thermal property of Sn58Bi solder joints for FCLED package
Crossref DOI link: https://doi.org/10.1007/s10854-020-03562-w
Published Online: 2020-05-13
Published Print: 2020-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lee, Choong-Jae
Myung, Woo-Ram
Park, Bum-Geun
Jung, Seung-Boo https://orcid.org/0000-0002-7360-9859
Funding for this research was provided by:
Ministry of Education (2019R1A6A1A03033215)
Ministry of Trade, Industry and Energy (20006956)
Text and Data Mining valid from 2020-05-13
Version of Record valid from 2020-05-13
Article History
Received: 14 March 2020
Revised: 3 May 2020
Accepted: 6 May 2020
First Online: 13 May 2020