Effect of nickel metallization thickness on microstructure evolution and mechanical properties in Sn3.0Ag0.5Cu/Au/Ni/Cu solder joints
Crossref DOI link: https://doi.org/10.1007/s10854-020-03705-z
Published Online: 2020-06-08
Published Print: 2020-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lin, Yutao
Li, Hailong http://orcid.org/0000-0002-9553-4878
Chen, Gang
Funding for this research was provided by:
National Natural Science Foundation of China (No. U1637203)
Text and Data Mining valid from 2020-06-08
Version of Record valid from 2020-06-08
Article History
Received: 23 February 2020
Accepted: 29 May 2020
First Online: 8 June 2020