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Effect of nickel metallization thickness on microstructure evolution and mechanical properties in Sn3.0Ag0.5Cu/Au/Ni/Cu solder joints

Published Online: 2020-06-08

Published Print: 2020-07

Authors

Lin, Yutao

Li, Hailong https://orcid.org/0000-0002-9553-4878
Chen, Gang
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (No. U1637203)
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Text and Data Mining valid from 2020-06-08

Version of Record valid from 2020-06-08
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Article History

Received: 23 February 2020

Accepted: 29 May 2020

First Online: 8 June 2020

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