The role of a nonconductive film (NCF) on Cu/Ni/Sn-Ag microbump interconnect reliability
Crossref DOI link: https://doi.org/10.1007/s10854-020-04115-x
Published Online: 2020-08-11
Published Print: 2020-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Ryu, Hyodong
Son, Kirak
Han, Jeong Sam
Park, Young-Bae http://orcid.org/0000-0003-0241-4584
Lee, Tae-Kyu
Text and Data Mining valid from 2020-08-11
Version of Record valid from 2020-08-11
Article History
Received: 26 May 2020
Accepted: 27 July 2020
First Online: 11 August 2020