Effects of Ni(P) layer thickness and Pd layer type in thin-Au/Pd/Ni(P) surface finishes on interfacial reactions and mechanical strength of Sn–58Bi solder joints during aging
Crossref DOI link: https://doi.org/10.1007/s10854-020-04509-x
Published Online: 2020-09-27
Published Print: 2020-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kim, Jungsoo
Jung, Seung-Boo
Yoon, Jeong-Won http://orcid.org/0000-0001-8708-542X
Text and Data Mining valid from 2020-09-27
Version of Record valid from 2020-09-27
Article History
Received: 10 August 2020
Accepted: 16 September 2020
First Online: 27 September 2020