Effect of purity of Al interlayer on stress and thermal cycling durability of die-attach Ni–Sn joints
Crossref DOI link: https://doi.org/10.1007/s10854-020-04651-6
Published Online: 2020-10-19
Published Print: 2020-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Ito, Hirofumi http://orcid.org/0000-0003-1591-7885
Kadoura, Hiroaki
Kuwahara, Makoto
Usui, Masanori
Text and Data Mining valid from 2020-10-19
Version of Record valid from 2020-10-19
Article History
Received: 7 July 2020
Accepted: 10 October 2020
First Online: 19 October 2020
Compliance with ethical standards
:
: The authors declare that they have no conflict of interest.