Effect of CNTs on the intermetallic compound growth between Sn solder and Cu substrate during aging and reflowing
Crossref DOI link: https://doi.org/10.1007/s10854-020-04755-z
Published Online: 2021-01-27
Published Print: 2021-02
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Xu, Kai-kai
Zhang, Liang http://orcid.org/0000-0003-3757-7009
Jiang, Nan
Funding for this research was provided by:
The Key project of State Key Laboratory of Advanced Welding and Joining (AWJ-19Z04)
Text and Data Mining valid from 2021-01-27
Version of Record valid from 2021-01-27
Article History
Received: 8 July 2020
Accepted: 26 October 2020
First Online: 27 January 2021