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Fan, Jilei

Li, Gang

Rajavel, Krishnamoorthy

Zhu, Pengli https://orcid.org/0000-0001-6830-7760

Sun, Rong

Wong, Ching-Ping

Funding for this research was provided by:

National Natural Science Foundation of China (61704182)

National Key R&D Project from Minister of Science and Technology of China (2016YFA0202702)

Youth Innovation Promotion Association of the Chinese Academy of Sciences (2017411)

SIATCAS-CUHK Joint Laboratory of Materials and Devices for High-Density Electronic Packaging.

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