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Effect of hybrid filler ratio and filler particle size on thermal conductivity and oil bleed of polydimethylsiloxane/Al2O3/ZnO liquid thermal filler for microelectronics packaging applications

Crossref DOI link: https://doi.org/10.1007/s10854-020-04864-9

Published Online: 2020-11-25

Published Print: 2021-01

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Kumaresan, Vigneshwarram

Sreekantan, Srimala https://orcid.org/0000-0001-5125-8683
Devarajan, Mutharasu

Mohamed, Khairudin
Funding

Funding for this research was provided by:

Universiti Sains Malaysia (203.PBAHAN.6071401)

WDC - USM (308.PFIZIK.41560108)
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Text and Data Mining valid from 2020-11-25

Version of Record valid from 2020-11-25
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Article History

Received: 1 September 2020

Accepted: 9 November 2020

First Online: 25 November 2020

Compliance with ethical standards

:

: The authors declare that they have no conflict of interest.

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